Capabilities

The current facilities and operations of JVIC can be broken down into five divisions. These areas are located in the fifteen labs and five clean rooms of the Jordan Valley Innovation center.  Inside the seven story research facility there are three and half floors of corporate laboratories, and three and half floors of shared laboratory facilities. While each division has a primary point of contact, most are complementary and share the use of JVIC’s facilities.  Not only does JVIC offer this lab space, it also houses conference rooms and a large demonstration area.

Microscopy and Characterization

The equipment and facilities in this area are used to investigate materials via imaging and electrotransport properties measurements. By use of Low Vacuum SEM, the Atomic Force Microscope, Infrared, and Nuclear Magnetic Resonance, those working in Microscopy and Characterization are able to study the structure of materials with nanometer resolution.

Novel Thin Film Sensors

JVIC’s capabilities allow for the deposition and modification of thin film materials for sensor development. Equipment in the Ion Implantation and Radiation Damage Facility includes thermal and electron beam evaporators, aligners, spin coaters, electroplating, and chemical vapor deposition. This equipment is used in micro-fabrication of Bio MEMS and IR detectors.

Computer Integrated Manufacturing

Utilizing robotics, equipment in this area is used in the prototype production of materials processing. CIM equipment includes a laser micro machining system and many other construction and development tools including lathes, mills, band saws, and welding. All of these tools are used in the fabrication or repair of casework, electronic panels, vacuum components, etc. The CIM line is a point of rapid prototyping; basically, manufacturing small quantities of parts for the use in the development of a new product.

Device Fabrication

Device fabrication concentrates on the development of application specific devices at the micro and nano scale. Spin coating, vacuum baking, wafer inspecting microscopes, and thin film thickness measurement tools are used to improve and measure the wafer devices produced at JVIC.

Sensor Data Supercomputing

The Cray Supercomputer allows for the large scale computing power needed for software engineering and large data calculations. Many processors are harnessed in this single, unified system. The four chassis system is very important in multidisciplinary uses.