The CASE team studies novel techniques for the production of materials made from carbon fibers and a binding polymer matrix. These materials are known for their high strength-to-weight ratio and are used in a variety of applications, including aerospace, automotive, and sports equipment. Both epoxy and phenolic resins can be used as the binding polymer matrix in carbon fiber composites. JVIC hosts a wide array of equipment and facilities for the research and development of these materials and their associated production methods.

In August 2022, NextFlex, a leading member of Manufacturing USA Innovation Institutes that focuses on semiconductors and flexible hybrid electronics, approved the Missouri Node at JVIC. This approval allows JVIC to increase the volume, pace, and coordination of the development of flexible hybrid electronics and other semiconductor technologies. The Node aims to foster collaboration with and among private businesses by providing investments in infrastructure for the rapid design, development, and manufacturing adoption.

Microscopy can be used to study the structure, composition, and behavior of various materials, such as metals, ceramics, polymers, and composites. Our lab houses equipment for various imaging techniques including SEM, FESEM/STEM, AFM, laser scanning confocal, optical, and high-precision 3D measurement. We also maintain a full suite of imaging systems for life sciences including fluorescence and calcium ion microscopes.

This is the process of creating thin films of materials on a substrate, such as a silicon wafer, by using physical or chemical methods. Materials deposition can be used to modify the properties of the substrate, such as electrical conductivity, optical reflectivity, or corrosion resistance. Capabilities include sputter coating, ultrasonic spray coating, chemical vapor deposition (CVD), atomic layer deposition (ALD).

Microlithography is the process of creating microscopic patterns on a thin film of protective material over a substrate, such as a silicon wafer, in order to protect selected areas of it during subsequent etching, deposition, or implantation operations. Microlithography is widely used in the fabrication of integrated circuits and microelectromechanical systems.

Characterization includes several processes that have to with ascertaining the structure and properties of various materials. In fact, the microscopy techniques listed above are characterization methods themselves. Other methods include spectroscopy and x-ray diffraction, both of which can also be done in our labs in various ways.